Method for adjusting a micro-mechanical device

Details Method for adjusting a micro-mechanical device Method for adjusting a micro-mechanical device

2005-01-04

2005-01-04

Tsai, H. Jey (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S051000

Reexamination Certificate

active

06838302

ABSTRACT:
A method for making a MEMS device comprises forming a plurality of micromechanical elements on a first substrate; forming circuitry and electrodes on a second substrate, the first and second substrates extending in a plane in X and Y directions; aligning the first and second substrates in the X and Y directions and moving the substrates toward each other in a Z direction and bonding the first and second substrates with a gap therebetween in the Z direction to form an assembly; singulating the assembly into assembly portions; and altering the gap for each assembly portion. Another embodiment involves aligning the first and second substrates in the X and Y directions and moving the substrates toward each other in a Z direction and bonding the first and second substrates with a gap therebetween in the Z direction to form an assembly; actuating and testing the micromechanical elements of the assembly; and altering the gap for each assembly. A further embodiment involves aligning the first and second substrates in the X and Y directions and moving the substrates toward each other in a Z direction and bonding the first and second substrates with a gap therebetween in the Z direction to form an assembly; wherein the micromechanical elements are actuated while bonding of the substrates.

REFERENCES:
patent: 6448622 (2002-09-01), Franke et al.

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