Method for adhering substrates using adhesive devices...

Coating processes – Medical or dental purpose product; parts; subcombinations;... – Flexible web – sheet – film – or filament base

Reexamination Certificate

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Details

C427S002100, C427S208000, C428S447000, C428S452000, C428S3550RA, C623S011110, C442S151000, C442S327000, C604S307000, C604S308000

Reexamination Certificate

active

06846508

ABSTRACT:
A method for adhering a first substrate to a second substrate using a double sided adhesive device based on silicone gels. The method is particularly useful for adhering a medical prosthesis to a human or animal body.

REFERENCES:
patent: 4621029 (1986-11-01), Kawaguchi
patent: 4832978 (1989-05-01), Lesser
patent: 4838253 (1989-06-01), Brassington et al.
patent: 4921704 (1990-05-01), Fabo
patent: 4991574 (1991-02-01), Pocknell
patent: 5094876 (1992-03-01), Goldberg et al.
patent: 638004 (1962-03-01), None
patent: 2101509 (1995-01-01), None
patent: 0308216 (1989-03-01), None
patent: 0300620 (1992-06-01), None
patent: 0322118 (1992-06-01), None
patent: 2205243 (1988-12-01), None
patent: 2 192 142 (1990-11-01), None
patent: 62155855 (1987-07-01), None
patent: 10095072 (1998-04-01), None
patent: WO 8600532 (1986-01-01), None
patent: 9609076 (1992-05-01), None
patent: 9319709 (1993-10-01), None
patent: 9319710 (1993-10-01), None
patent: WO9424964 (1994-11-01), None
patent: 9522997 (1995-08-01), None
patent: 9629374 (1996-09-01), None

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