Method for adhering one surface to another

Details Method for adhering one surface to another Method for adhering one surface to another

1975-04-18

1976-07-20

Drummond, Douglas J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29424, 29589, 106270, 106271, 106285, 156286, 156326, 156299, 156333, 156320, 156344, 260 28R, 260 285A, 260 285D, 428484, B32B 3100, C08L 9106, C09D 3387

Patent

active

039704947

ABSTRACT:
A chlorinated naphthalene and a paraterphenyl are mixed to provide an adhesive for adhering a semiconductor wafer to a support for processing.
The adhesive so formed may be evaporated at the end of processing the wafer, without leaving a residue, to release the devices which have been formed from the wafer.

REFERENCES:
patent: 2046526 (1936-07-01), Moose
patent: 3078559 (1963-02-01), Thomas
patent: 3117100 (1964-01-01), Cox et al.
patent: 3586559 (1971-06-01), Shepard
patent: 3752717 (1973-08-01), White
Hardie, "Chlorinated Naphthalenes," Kirk-Othmer ect vol. 5 pp. 297-303, copyright, 1964.
Hubbard, "Terphenyls," Kirk-Othmer ECT vol. 7 pp. 194-204, copyright 1965.

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