Method for adhering a metallization to a substrate

Details Method for adhering a metallization to a substrate Method for adhering a metallization to a substrate

1997-10-06

1999-03-16

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438106, 438118, H01L 2144, H01L 2148, H01L 2150

Patent

active

058829547

ABSTRACT:
There is disclosed herein a method for adhering metallizations to a substrate, comprising the steps of: (1) providing a substrate having a first surface; (2) applying a coating atop the first surface, such that the coating has a second surface bonded to the first surface, and a third surface generally conforming with the second surface; (3) etching away material from the third surface, so as to roughen and form pits in the third surface; and (4) attaching a metallization to the pits in the third surface by plating, sputtering, or similar means.

REFERENCES:
patent: 2912745 (1959-08-01), Steigerwalt et al.
patent: 2971249 (1961-09-01), Anderson et al.
patent: 3560257 (1971-02-01), Schneble, Jr. et al.
patent: 4100312 (1978-07-01), Lombardo et al.
patent: 4465538 (1984-08-01), Schmoock
patent: 4640866 (1987-02-01), Suzuki
patent: 4935090 (1990-06-01), Brower
patent: 5265329 (1993-11-01), Jones et al.
patent: 5390412 (1995-02-01), Gregoire
patent: 5451755 (1995-09-01), Gregoire
patent: 5541366 (1996-07-01), Maoz et al.
patent: 5559056 (1996-09-01), Weiler
patent: 5578527 (1996-11-01), Chang et al.
patent: 5656551 (1997-08-01), Corbett et al.
patent: 5668059 (1997-09-01), Christie et al.
patent: 5728606 (1998-03-01), Laine

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