Method for additive de-marking of packaged integrated circuits a

Details Method for additive de-marking of packaged integrated circuits a Method for additive de-marking of packaged integrated circuits a

1998-02-02

2000-09-19

Picardat, Kevin M.

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

438 22, 438106, 438107, H01L 2100

Patent

active

061210676

ABSTRACT:
A method for additively de-marking a packaged integrated circuit die bearing engraved marking indicia on an exterior surface thereof. The marked surface is covered with an overlayer of material to fill the engraved markings and provide a surface suitable for re-marking. The covering material may be applied in a flowable state by applicator contact or by non-contact dispensing, or may be applied as a preformed segment. The exterior surface to be covered may be pre-treated to enhance bonding of the covering material. The covering material may be bonded to the marked surface in a post-application curing operation. De-marked integrated circuit packages are also disclosed.

REFERENCES:
patent: 3751587 (1973-08-01), Insler et al.
patent: 4148057 (1979-04-01), Jesse
patent: 4375025 (1983-02-01), Carlson
patent: 4585931 (1986-04-01), Duncan et al.
patent: 4638144 (1987-01-01), Latta, Jr.
patent: 4707722 (1987-11-01), Folk et al.
patent: 4719502 (1988-01-01), Ikeya et al.
patent: 4753863 (1988-06-01), Spanjer
patent: 4861620 (1989-08-01), Azuma et al.
patent: 4945204 (1990-07-01), Nakamura et al.
patent: 4964948 (1990-10-01), Reed
patent: 5030551 (1991-07-01), Herren et al.
patent: 5157412 (1992-10-01), Kleinschmidt et al.
patent: 5206280 (1993-04-01), Williams
patent: 5262470 (1993-11-01), Shimotsuma et al.
patent: 5268194 (1993-12-01), Kawakami et al.
patent: 5302553 (1994-04-01), Abbott et al.
patent: 5329090 (1994-07-01), Woelki et al.
patent: 5346802 (1994-09-01), Ohbachi et al.
patent: 5348033 (1994-09-01), Levit
patent: 5357077 (1994-10-01), Tsuruta
patent: 5373039 (1994-12-01), Sakai et al.
patent: 5413629 (1995-05-01), Yasui et al.
patent: 5445923 (1995-08-01), Takahashi et al.
patent: 5493801 (1996-02-01), James
patent: 5741361 (1998-04-01), McKinnon et al.
patent: 5761803 (1998-06-01), St. John et al.
patent: 5817541 (1998-10-01), Averkiou et al.
patent: 5822856 (1998-10-01), Bhatt et al.
patent: 5887345 (1999-03-01), Kulesza et al.

Affiliated with

Also associated with

Rating

Method for additive de-marking of packaged integrated circuits a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for additive de-marking of packaged integrated circuits a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for additive de-marking of packaged integrated circuits a will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1071895