Method for adding layers to a PWB which yields high levels of co

Details Method for adding layers to a PWB which yields high levels of co Method for adding layers to a PWB which yields high levels of co

1996-09-17

1999-12-07

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438783, H01L 2144

Patent

active

059982373

ABSTRACT:
A permanent curable photosensitive liquid dielectric polymer composition is disclosed for making copper printed circuit boards having at least one photosensitive dielectric polymer layer containing vias and circuitry thereon wherein the polymer layer has enhanced copper to dielectric adhesion. The dielectric composition preferably comprises an acrylated epoxy and a metal adhesion effective amount of amorphous silica. Printed circuit boards made using the photodefinable dielectric polymer and a method for making the printed circuit boards are also disclosed. A twice performed permanganate etching process for texturing the dielectric surface is also preferably used to further enhance the copper to dielectric adhesion.

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