Method for achieving uniform CU CMP polishing

Details Method for achieving uniform CU CMP polishing Method for achieving uniform CU CMP polishing

2006-12-26

2006-12-26

Shakeri, Hadi (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S041000, C451S054000, C134S003000, C134S902000, C156S345120, C257SE21304

Reexamination Certificate

active

07153197

ABSTRACT:
A method for removing a metal oxide overlayer over a target polishing surface in conjunction with a chemical mechanical polishing (CMP) process to improve polishing uniformity including providing a substrate target polishing surface having a layer of an oxide of a metal overlying said metal to be chemically mechanically polished; removing the layer of an oxide of the metal using an oxide removal solution prior to performing a CMP process with an abrasive slurry; and, polishing the target polishing surface according to an a CMP process with an abrasive slurry including at least one of an oxidizer and a complexing agent.

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