Method for accurate calculation of vertex movement for three-dim

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364468, 364578, 395120, G06F 1546, G06F 1572

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053771184

ABSTRACT:
A method for accurately calculating the movement of a vertex in a three-dimensional (3-D) topography simulator. The method is particularly suited for calculating vertex movement for cases in which etch/deposition rate depends on the angle between the surface normal and the vertical direction. A workpiece is represented as a collection of material solids. Each of the material solids has a boundary model representation. The method of the present invention is comprised primarily of the steps of: advancing edges and surface planes adjacent to the vertex, creating a set of 2-D solutions by clipping with pairs of adjacent surface planes; creating a set of combined 2-D solutions by clipping invalid sections of combined 2-D solutions; construct an arbitrary vertical plane that intersects the surface at the vertex point; constructing vertex trajectories for the vertex to be moved; and clipping constructed vertex trajectories at intersections of created surface and the constructed vertical plane.

REFERENCES:
patent: 4208810 (1980-06-01), Rohner et al.
patent: 4554625 (1985-11-01), Otten
patent: 4785399 (1988-11-01), Evans et al.
patent: 4797842 (1989-01-01), Nackman et al.
patent: 4819161 (1989-04-01), Konno et al.
patent: 4912664 (1990-03-01), Weiss et al.
patent: 4933889 (1990-06-01), Meshkat et al.
patent: 5036316 (1991-06-01), Kemplin
patent: 5067101 (1991-11-01), Kunikiyo et al.
patent: 5070469 (1991-12-01), Kunikiyo et al.
patent: 5125038 (1992-06-01), Meshkat et al.
patent: 5159512 (1992-10-01), Evans et al.
patent: 5214752 (1993-05-01), Meshkat et al.
R. C. Evans, G. Koppelman, V. T. Rajan, Shaping Geometric Objects by Cumulative Translational Sweeps, May 1987, IBM J. Res. Develop. vol. 31 No. 3, pp. 343-360.
Aristides A. G. Requicha, Representations For Rigid Solids: Theory, Methods, and Systems, Production Automation Project, College of Engineering and Applied Science, The University of Rochester, Rochester, N.Y. 14627, pp. 437-465, Jun. 1980.
A. Baer, C. Eastman, M. Henrion, Geometric Modelling: A Survey, IPC Business Press, vol. 11, No. 5, Sep. 1979, pp. 253-272.
Fujio Yamaguchi, Yoshiya Tokieda, Kyushu Institute of Design, A Unified Algorithm For Boolean Shape Operations, IEEE Jun. 1984, pp. 24-37.
Masato Fujinaga, Norihiko Kotani, Tatsuya Kunikiyo, Hidekazu Oda, Masayoshi Shirahata, Yoichi Akasaka, Three-Dimensional Topography Simulation Model: Etching and Lithography, IEEE Transactions On Electron Devices vol. 37, No. 10, Oct. 1990, pp. 2183-2192.
T. S. Cale, G. B. Raupp, T. H. Gandy, Ballisic Transport-Reaction Prediction Of Film Conformality In Tetraethoxysilane O.sub.2 Plasma Enhanced Deposition Of Silicon Dioxide, American Vacuum Society, J. Vac. Sci. Technology A. 10(4), Jul./Aug. 1992, pp. 1128-1134.
George M. Koppelman, Michael A. Wesley, Oyster: A Study of Integraded Circuits As Three-Dimensional Structures, IMB J. Res. Develop. vol. 27, No. 2, Mar. 1983.
R. N. Wolfe, M. A. Wesley, J. C. Kyle, Jr., F. Gracer, W. J. Fitzgerald, IBM Journal of Research and Development: Solid Modeling For Production Design, vol. 31, No. 3, May 1987, pp. 277-295.
J. Pelka, M. Weiss, W. Hoppe, D. Mewes, The Influence of Ion Scattering on Dry Etch Profiles, J. Vac. Sci. Technol. B. vol. 7, No. 6, Nov./Dec. 1989, pp. 1483-1486.
M. Mazhar Islamraja, J. P. McVittie, M. Cappelli, K. C. Saraswat, A General Analytical Model for Low-Pressure Deposition in 3-D Structures, pp. 93-94.
Toshiharu Matsuzawa, Tetsuo Ito, Masaya Tanuma, Three-Dimensional Photoresist Image Simulation on Flat Surfaces, IEEE Transactions On Electron Devices, vol. ED-32, No. 9, Sep. 1985.
Yoshihiko Hirai, Sadafumi Tomida, Kazushi Ikeda, Masaru Sasago, Masayki Endo, Sigeru Hayama, Noboru Nomura, Three-Dimensional Resist Process Simulator Peace (Photo and Electron Beam Lithography Analyzing Computer Engineering System), IEEE Transactions on Computer-Aided Design, vol. 10, No. 6, Jun. 1991, pp. 802-807.
Silvaco International, Solid: Three Dimensional Lithography Simulation Software, Version 1.06, User's Manual Introduction, Jul. 31, 1991, pp. 1-3.
I. V. Katardjiev, Simulation of Surface Evolution During Ion Bombardment, J. Vac. Sci. Technol. A 6(4), Jul./Aug. 1988, pp. 2434-2442.
R. Smith, M. A. Tagg, G. Carter, M. J. Nobes, Erosion of Corners and Edges on an Ion-Bombarded Silicon Surface, Journal of Materials Science Letters (1986) pp. 115-120.
I. V. Katardjiev, G. Carter, M. J. Nobes, R. Smith, Precision Modeling of the Mask-Substrate Evolution During Ion Etching, J. Vac. Sci. Technol. A6(4), Jul./Aug. 1988, pp. 2443-2450.
Bruce Schachter, Decomposition of Polygons Into Convex Sets, IEEE Transactions on Computers, vol. C-27, No. 11, Sep. 1978, pp. 10-78-1080.
Tim Thurgate, Segment-Based Etch Algorithm and Modeling, IEEE Transactions on Computer-Aided Design, vol. 10, No. 9, Sep. 1991, pp. 1101-1109.
Eric S. G. Shaqfeh, Charles W. Jurgensen, Simulations of Reactive Ion Etching Pattern Transfer, J. Appl. Phys. 66(10), Nov. 15, 1989.
E. W. Scheckler, K. K. H. Toh, D. M. Hoffstetter, A. R. Neureuther, 3D Lithography, Etching, and Deposition Simulation (Sample-3D), 1991 Sumposium On VLSI Technology Digest of Technical Papers, May 28-30, 1991/OISO, pp. 97-98.

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