Method for a semiconductor assembly having a semiconductor...

Details Method for a semiconductor assembly having a semiconductor... Method for a semiconductor assembly having a semiconductor...

2005-07-26

2005-07-26

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S842000, C029S827000, C029S855000, C029S857000, C029S830000, C438S122000, C438S127000, C257S678000, C257S718000, C257S720000

Reexamination Certificate

active

06920688

ABSTRACT:
A method of making an integrated circuit device using an encapsulated semiconductor die, having leads extending therefrom and attaching a heat spreader to each of the major outer encapsulant surfaces thereof, is disclosed. One or both of the heat spreaders has a pair of end posts configured for allowing further encapsulation of portions thereof and insertion into through-holes in a substrate to position and support the device during and following the outer lead solder reflow step at board assembly. The heat spreaders provide high heat dissipation and EMR shielding, and may be connected to the substrate ground to become ground planes.

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