Method for a repair process

Details Method for a repair process Method for a repair process

2011-01-25

2011-01-25

Ahmed, Shamim (Department: 1713)

Etching a substrate: processes

Nongaseous phase etching of substrate

C216S096000, C216S108000, C427S140000, C427S142000

Reexamination Certificate

active

07875200

ABSTRACT:
A method for a repair process includes the steps of subjecting a substrate coated with at least one protective metallic coating to a nitric acid solution and then subjecting the substrate with the at least one protective metallic coating to a hydrochloric acid solution to remove the at least one protective metallic coating from the substrate. The substrate includes about 5 wt %-15 wt % chromium, about 2 wt %-8 wt % cobalt, about 2 wt %-6 wt % tungsten, about 0.5 wt %-2.5 wt % titanium, about 8 wt %-16 wt % tantalum, about 2 wt %-8 wt % aluminum, hafnium in an amount no greater than 1 wt %, and a remainder of nickel.

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Extended European Search Report for EP09250999 mailed on Sep. 21, 2009.

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