Fishing – trapping – and vermin destroying
Patent
1995-06-07
1996-12-31
Picardat, Kevin M.
Fishing, trapping, and vermin destroying
437209, 437214, 437217, 437219, H01L 2160
Patent
active
055894208
ABSTRACT:
A hybrid leadframe-over-chip (LOC) semiconductor package is generally comprised of bonding finger elements located over a surface of a semiconductor component and electrically coupled, by means of conducting wires, to the bonding pads located on the surface. In addition, at least one bonding finger is located outside the boundary of the surface of the semiconductor component. Each bonding finger located outside the boundary is coupled, by a conducting wire, to a bonding pad positioned within the boundary of the semiconductor component. In this manner, for a given semiconductor component size and for given routing and lead dimension constraints, a larger number of conducting paths can be provided between the leadframe and the semiconductor component.
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Donaldson Richard
Holland Robby
Holloway William
Picardat Kevin M.
Texas Instruments Incorporated
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