Method employing an elevating of atmospheric pressure during the

Details Method employing an elevating of atmospheric pressure during the Method employing an elevating of atmospheric pressure during the

1994-01-10

1995-01-31

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228246, H05K 334

Patent

active

053852915

ABSTRACT:
There is a method for increasing the life of the mechanical bonding between the PCB and the surface mount IC. Specifically, the invention elevates the atmospheric pressure during the heating and cooling phases of Ball Grid Array (BGA) soldering of an IC device to a PCB. This accomplishes a decreasing of the curvature of the solder ball wall inherent in the typical BGA technique. Uniquely, by increasing the atmospheric pressure around the solder ball during the cooling phases, specifically, the outer pressure will decrease the outer curvature of the walls. This allows the PCB and IC to increase the stand off distance, and increase the strength of the mechanical properties of the weld. With stronger bonding, the ICs will stay bonded longer to the PCB before deteriorating and thereby needing replacement.

REFERENCES:
patent: 4760948 (1988-08-01), Spiecker
patent: 4878611 (1989-11-01), LoVasco et al.
patent: 4914814 (1990-04-01), Behun et al.
patent: 5222014 (1993-06-01), Lin

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