Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Patent
1997-09-19
1999-09-28
Brown, Peter Toby
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
438 32, 438 42, 372 96, 372102, 148DIG95, H01L 2100
Patent
active
059602570
ABSTRACT:
A distributed feedback semiconductor laser which includes a semiconductor substrate of a first conductive type; a semiconductor multi-layer structure provided on the semiconductor substrate and including an active layer for generating laser light; and a gain-coupled diffraction grating provided between the semiconductor substrate and the semiconductor multi-layer structure. The diffraction grating includes a plurality of curved projections periodically arranged at a surface of the semiconductor substrate and a quantum well light absorption layer for covering the plurality of curved projections. The quantum well light absorption layer includes a light absorption area having a first thickness at each border between two adjacent curved projections and a non-light absorption area having a second thickness which is smaller than the first thickness at a top of each of the curved projections. The light absorption area has a band gap which is narrower than a band gap of the active layer, and the non-light absorption area has a band gap which is wider than the band gap of the active layer.
REFERENCES:
patent: 4573158 (1986-02-01), Utaka et al.
patent: 4622114 (1986-11-01), Glass et al.
patent: 4704720 (1987-11-01), Yamaguchi
patent: 4786951 (1988-11-01), Tokuda et al.
patent: 5093835 (1992-03-01), Takemoto et al.
patent: 5143864 (1992-09-01), Takemoto et al.
patent: 5208824 (1993-05-01), Tsang
patent: 5276702 (1994-01-01), Meliga
patent: 5289494 (1994-02-01), Tada et al.
patent: 5292685 (1994-03-01), Inoguchi et al.
patent: 5452318 (1995-09-01), Makino et al.
patent: 5528413 (1996-06-01), Ishimura
patent: 5539766 (1996-07-01), Ishino et al.
patent: 5581570 (1996-12-01), Yoshida et al.
patent: 5764682 (1998-06-01), Ishino et al.
Y. Luo et al., "Purely Gain-Coupled Distributed Feedback Semiconductor Lasers", Appl. Phys. Lett. 56(17), pp. 1620-1622 (Apr. 1990).
T. Makino et al., "High Performance 1.55 .mu.m Strained-Layer MQW Gain-coupled DFB Lasers", Optoelectronics Conference Digest. pp. 402-403 (Jul. 1994).
K. Kudo et al., "New method to Reduce Effective Linewidth Enhancement Factor .alpha..sub.eff of DSM Lasers using Optical Complex Coupling", 13th IEEE International Semiconductor Laser Conference. pp. 16-17 (1992).
W.T. Tsang, et al., "Semiconductor Distributed Feedback Lasers with Quantum Well or Superlattice Gratings for Index or Gain-Coupled Optical Feedback", Appl. Phys. Letters. vol. 60, No. 21, pp. 2580-2582 (May 1992).
Long-Wavelength InGaAsP/InP Distributed Feedback Lasers Incororating Gain-Coupled Mechanism, IEEE Phontonics Technology Letters, vol. 4, No. 3, pp. 212-215 (Mar. 1992).
B. Borchert et al., "Fabrication and Characteristics of Improved Strained Quantum-Well GaInAIAs Gain-Coupled DFB Lasers", Electronics Letters, vol. 29, No. 2, pp. 210-211 (Jan. 1993).
German Search Report dated Oct. 26, 1995 w/translation.
D. H. Jang et al., "InAsP Phase Formation During the Growth of GalnAsP/InP Distributed Feeback Lasr Diode Structure on Corrugated InP using Metalorganic Vapor Phase Epitaxy", Applied Physics Letters, 66(23), Jun. 5, 1995, pp. 3191-3193).
Ishino Masato
Kitoh Masahiro
Matsui Yasushi
Otsuka Nobuyuki
Brown Peter Toby
Matsushita Electric - Industrial Co., Ltd.
Pham Long
LandOfFree
Method distributed feedback semiconductor laser for fabricating does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method distributed feedback semiconductor laser for fabricating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method distributed feedback semiconductor laser for fabricating will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-714951