Method, device and system for bonding a semiconductor element

Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...

Reexamination Certificate

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C228S104000, C228S180500

Reexamination Certificate

active

07654434

ABSTRACT:
The invention relates to a method and also a device and a system for bonding a semiconductor element (4), in which various contact areas (8) of the semiconductor element (4) are successively connected to terminal areas (2, 3, 7) by means of bonding wire elements (6) and in which an electrical variable influenced by the semiconductor element (4) is acquired during the bonding operation.

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