Method, device and system for bonding a semiconductor element

Details Method, device and system for bonding a semiconductor element Method, device and system for bonding a semiconductor element

2006-03-20

2010-02-02

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

C228S104000, C228S180500

Reexamination Certificate

active

07654434

ABSTRACT:
The invention relates to a method and also a device and a system for bonding a semiconductor element (4), in which various contact areas (8) of the semiconductor element (4) are successively connected to terminal areas (2, 3, 7) by means of bonding wire elements (6) and in which an electrical variable influenced by the semiconductor element (4) is acquired during the bonding operation.

REFERENCES:
patent: 4555052 (1985-11-01), Kurtz et al.
patent: 4586642 (1986-05-01), Dreibelbis et al.
patent: 4984730 (1991-01-01), Gobel et al.
patent: 5314105 (1994-05-01), Farassat
patent: 6085962 (2000-07-01), Jacobson et al.
patent: 6467678 (2002-10-01), Mochida et al.
patent: 6492828 (2002-12-01), Ming-Hsun et al.
patent: 6568581 (2003-05-01), Boller et al.
patent: 6877650 (2005-04-01), Marsh et al.
patent: 2001/0030548 (2001-10-01), Farnworth et al.
patent: 2001/0054908 (2001-12-01), Farnworth et al.
patent: 2004/0150409 (2004-08-01), Yamaoka et al.
patent: 2004/0221653 (2004-11-01), Farassat
patent: 2005/0040839 (2005-02-01), Neaves et al.
patent: 2005/0046428 (2005-03-01), Tesdahl et al.
patent: 2005/0242824 (2005-11-01), Parker et al.
patent: 2005/0253616 (2005-11-01), Parker et al.
patent: 2006/0152244 (2006-07-01), Neaves et al.
patent: 2006/0170446 (2006-08-01), Neaves et al.
patent: 2006/0181301 (2006-08-01), Neaves et al.
patent: 2006/0197539 (2006-09-01), Schneider et al.
patent: 2007/0007978 (2007-01-01), Parker et al.
patent: 63007643 (1988-01-01), None
patent: 2003059981 (2003-02-01), None
Elektrische Kontaktierungen in Mikrosystemen—Drahtbonden, (www.tu.cottbus.de/MST/lehre/scripte/UES-Bonden.pdf, 16 pages.
Farhad Farassat, Wire bonding process control (www.seiconductorfabtech.com from the company F & K Delvotech GmbH, 9 pages, Jan. 17, 2005.

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