Method component on a circuit board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S739000, C029S740000, C029S832000, C029S833000, C029S720000

Reexamination Certificate

active

10922731

ABSTRACT:
A method of mounting a component on electrodes on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solders for the component is situated on the electrodes. The printing positions of the solders are stored. Mounting position data for where the component is to be mounted on the solders is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.

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patent: 2002-118396 (2002-04-01), None

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