Method, apparatus and system for use in processing wafers

Details Method, apparatus and system for use in processing wafers Method, apparatus and system for use in processing wafers

2007-07-31

2007-07-31

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S005000

Reexamination Certificate

active

11173992

ABSTRACT:
The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

REFERENCES:
patent: 4653231 (1987-03-01), Cronkhite et al.
patent: 5584647 (1996-12-01), Uehara et al.
patent: 6045716 (2000-04-01), Walsh et al.
patent: 6155768 (2000-12-01), Bacchi et al.
patent: 6354926 (2002-03-01), Walsh
patent: 6525498 (2003-02-01), Zalkin et al.
patent: 6547510 (2003-04-01), Beaulieu
patent: 6625513 (2003-09-01), Lymberopoulos et al.
patent: 6916231 (2005-07-01), Wakabayashi
patent: 05-305560 (1993-11-01), None
International Search Report and Written Opinion, PCT/US05/23772, mailed Oct. 31, 2005.

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