Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1999-05-14
2000-07-18
Brown, Glenn W.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324754, 324760, G01R 106, G01R 3126
Patent
active
060912529
ABSTRACT:
A method, apparatus and system for establishing temporary electrical communication with semiconductor components having contact bumps are provided. The apparatus includes an interconnect having patterns of contact members adapted to electrically contact the contact bumps. Each contact member includes an array of one or more electrically conductive projections in electrical communication with an associated conductor. The projections form contact members for retaining individual contact bumps on the semiconductor components. The projections can be pillars having angled faces covered with a conductive layer. Alternately the projections can be a material deposited on the substrate, or can be microbumps formed on multi layered tape bonded to the substrate. The interconnect can be employed in a wafer level test system for testing dice contained on a wafer, or in a die level test system for testing bare bumped dice or bumped chip scale packages.
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Akram Salman
Farnworth Warren M.
Hembree David R.
Wood Alan G.
Brown Glenn W.
Gratton Stephen A.
Micron Technolopgy, Inc.
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