Plastic article or earthenware shaping or treating: apparatus – With apparatus assembly or dismantling means or with idle part – For extrusion or injection type shaping means
Reexamination Certificate
2007-05-15
2010-11-02
Davis, Robert B (Department: 1791)
Plastic article or earthenware shaping or treating: apparatus
With apparatus assembly or dismantling means or with idle part
For extrusion or injection type shaping means
C425S195000, C164S341000, C164S342000, C249S102000
Reexamination Certificate
active
07824168
ABSTRACT:
A mold clamping apparatus for a die casting machine is provided. The apparatus can include a base, a fixed die plate standing fixedly on an end of an injection side of the base and defining a cavity therein, and a moving die plate arranged so as to proceed and retract on the base facing the fixed die plate and defining a cavity therein. A first versatile main mold can be disposed in the cavity of the fixed die plate and adapted to receive an insert die. Further, a second versatile main mold can be disposed in the cavity of the moving die plate and adapted to receive an insert die.
REFERENCES:
patent: 2424235 (1947-07-01), Hoffer
patent: 3507012 (1970-04-01), Katashi
patent: 3871611 (1975-03-01), Taketa
patent: 4064928 (1977-12-01), Wunder
patent: 4202522 (1980-05-01), Hanas et al.
patent: 4551084 (1985-11-01), Lake
patent: 4684101 (1987-08-01), Wagner et al.
patent: 4803772 (1989-02-01), Leverenz
patent: 4952131 (1990-08-01), Shirai et al.
patent: 4959002 (1990-09-01), Pleasant
patent: 4993933 (1991-02-01), Yoshioka et al.
patent: 5049526 (1991-09-01), McShane et al.
patent: 5063648 (1991-11-01), Yonezawa et al.
patent: 5114330 (1992-05-01), Nielsen
patent: 5288222 (1994-02-01), Wieser
patent: 5302105 (1994-04-01), Bertleff
patent: 5352394 (1994-10-01), Fujita et al.
patent: 5536463 (1996-07-01), Baccman
patent: 5753153 (1998-05-01), Choi
patent: 5863474 (1999-01-01), Ito et al.
patent: 5871683 (1999-02-01), Schaper et al.
patent: 5979536 (1999-11-01), Iwamoto
patent: 6070643 (2000-06-01), Colvin
patent: 6499986 (2002-12-01), Saito
patent: 6558149 (2003-05-01), Bodmer et al.
patent: 6702912 (2004-03-01), Oku et al.
patent: 6821104 (2004-11-01), Kubota et al.
patent: 6843647 (2005-01-01), Fujita et al.
patent: 6896505 (2005-05-01), Towery et al.
patent: 7204685 (2007-04-01), Crain et al.
patent: 2003/0138513 (2003-07-01), Matsuura et al.
patent: 2003/0150586 (2003-08-01), Matsuura et al.
patent: 2004/0247740 (2004-12-01), Tsuji et al.
patent: 1061741 (1992-06-01), None
patent: 1550311 (2004-12-01), None
patent: 2001-054913 (2001-02-01), None
Final Office Action; U.S. Appl. No. 11/415,193 mailed Oct. 4, 2007.
Non-Final Office Action; U.S. Appl. No. 11/415,193 mailed Feb. 12, 2008.
Chinese Office Action issued in Application No. 200610106059.4 mailed Jul. 4, 2008.
English Translation of Chinese Office Action issued in Application No. 200610106059.4 mailed Jul. 4, 2008.
Final Office Action; U.S. Appl. No. 11/415,193 mailed Aug. 25, 2008.
Chinese Office Action issued n Application No. 200610106059.4 dated Dec. 19, 2008.
English Translation of Chinese Office Action issued in Application No. 200610106059.4 dated Dec. 19, 2008.
Office Action issued in U.S. Appl. No. 11/415,193 mailed Feb. 10, 2009.
Chinese Office Action issued in CN Appl 200610106059.4 on May 22, 2009.
English Translation of Chinese Office Action issued in CN Appl 200610106059.4 on May 22, 2009.
Final Office Action issued in U.S. Appl. No. 11/415,193, mailed Jun. 12, 2009.
Office Action issued in U.S. Appl. No. 11/953,976 mailed Sep. 23, 2009.
Notice of Allowance issued in U.S. Appl. No. 11/415,193 mailed Sep. 21, 2009.
Partial mechanical translation of JP 2001-054913 published Feb. 2001.
English Abstract of JP 2001-054913 published Feb. 2001.
Notice of Allowance issued in U.S. Appl. No. 11/953,976 mailed Feb. 1, 2010.
Notice of Allowance issued in U.S. Appl. No. 11/415,193 mailed Dec. 23, 2009.
Itani Shinya
Tsuji Makoto
Yokoyama Hiroshi
Davis Robert B
DLA Piper (LLP) US
Toshiba Kikai Kabushiki Kaisha
LandOfFree
Method, apparatus, and system for changing a mold in a die... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method, apparatus, and system for changing a mold in a die..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method, apparatus, and system for changing a mold in a die... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4243197