Metal fusion bonding – Process – With condition responsive – program – or timing control
Reexamination Certificate
2003-07-30
2009-06-23
Ward, Jessica L (Department: 1793)
Metal fusion bonding
Process
With condition responsive, program, or timing control
C228S103000, C228S009000, C219S494000
Reexamination Certificate
active
07549566
ABSTRACT:
A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, a temperature profile of the object heated under a modified heating condition may be simulated in a short period of time without actually heating and measuring the temperature of the object at a high accuracy level. By using such a simulation, an appropriate heating condition for heating an object in accordance with a desired heating condition may easily be determined.
REFERENCES:
patent: 4775776 (1988-10-01), Rahn et al.
patent: 4927068 (1990-05-01), Naka et al.
patent: 5003160 (1991-03-01), Matsuo et al.
patent: 5099442 (1992-03-01), Furuta et al.
patent: 5561612 (1996-10-01), Thakur
patent: 6206265 (2001-03-01), Yamaoka
patent: 6283379 (2001-09-01), Kazmierowicz et al.
patent: 6610968 (2003-08-01), Shajii et al.
patent: 6619531 (2003-09-01), Yamaoka
Morales S., et al., entitled “A Pole-Placement Partial State Reference Model Adaptive Control of a Rapid Thermal Processor”, Proceedings of the International Conference on Systems, Man and Cybernetics. Le Touquet, Oct. 17-20, 1993, New York, IEEE, US, vol. 3, Oct. 17, 1993, pp. 19-24, XP010132092.
S. Morales et al., “A Pole-Placement Partial State Reference Model Adaptive Control of a Rapid Thermal Processor”, Proceedings of the International Conference on Systems, Man and Cybernetics, Le Touquet, Oct. 17-20, 1993, New York, IEEE, US, vol. 3, pp. 19-24.
Isobata Yoshinori
Nonomura Masaru
Onishi Hiroaki
Taniguchi Masahiro
Aboagye Michael
Panasonic Corporation
Ward Jessica L
Wenderoth , Lind & Ponack, L.L.P.
LandOfFree
Method, apparatus and program of thermal analysis, heat... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method, apparatus and program of thermal analysis, heat..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method, apparatus and program of thermal analysis, heat... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4064791