Method and use of a device for applying coatings to...

Details Method and use of a device for applying coatings to... Method and use of a device for applying coatings to...

2006-10-13

2009-12-22

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S126000, C438S782000, C257SE21502

Reexamination Certificate

active

07635612

ABSTRACT:
In a device (35) and a method a thin organic or inorganic layer is applied to individual component positions of band-like structures (1). The layer can effect improved or optimized adhesion between a coated surface and a plastic housing compound. Furthermore, the layer can be used as a corrosion prevention layer, an electrical insulating layer or as a dielectric for the coated surfaces. For the selective application of the layer, the device (35) has a jet printer (2) having a plurality of electronically controllable jet heads (4-7). The jet printer (2) coats the band-like structures (1) selectively on the upper side (17) in a first coating position (15) and coats the band-like structures (1) selectively on the underside (18) in a second coating position (16).

REFERENCES:
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patent: 5976955 (1999-11-01), Hodges
patent: 6110537 (2000-08-01), Heffner et al.
patent: 2002/0066966 (2002-06-01), Farnworth
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patent: 03023878 (2003-03-01), None
International Preliminary Search Report, PCT/DE2005/000639, 8 pgs, mailing date Nov. 9, 2006.
Examination Report for DE 10 2004 018 483.6-33 dated Feb. 21, 2005 issued by the German Patent Office.

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