Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask
Patent
1998-04-20
2000-03-21
Young, Christopher G.
Radiation imagery chemistry: process, composition, or product th
Radiation modifying product or process of making
Radiation mask
430 22, 430 30, G03F 900
Patent
active
060400935
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a film carrier that is used for TAB mounting of electronic devices such as semiconductor devices, to a method of transferring conductive patters to correct positions, and to masks to be used therefor.
2. Discussion of the Related Art
When electronic devices, such as, semiconductor devices, are mounted with TAB (Tape Automated bonding), a film carrier is used as a base substrate. One example of a film carrier is shown in FIG. 1.
A film carrier has an insulation film 2 as a base substrate material, a conductor pattern 8 provided on the film, and an aperture 6 provided at a position separated a predetermined distance from each of both edges of the film 2. The aperture 6 shown in FIG. 1 is positioned generally at the center of the tape in its width direction (a direction perpendicular to the transfer direction). The film 2 has index perforation holes (which are also called sprocket holes, and hereinafter referred to as "IP") 4 formed along both of the edges in the transfer direction. The IP 4 is used to control feeding of the film in a variety of transfer processes and used as references for position coordinates on the film, for example, in the manufacture of a film carrier wherein a conductor pattern is formed on the film, in the feeding or positioning steps in ILB (inner lead bonding) process, and the like. A part of the conductive pattern 8 protrudes into the aperture 6 (the protruded section is called an "inner lead"), wherein electronic devices such as semiconductor devices are electrically connected to the inner lead section. In other words, electrode sections of an electronic device are positioned within the aperture 6.
A conductive pattern 8 of a film carrier is typically manufactured by the following steps as shown in FIGS. 2(a)-2(g). copper film (FIG. 2(b)) on a top surface of a film 2 that defines IP 4 and apertures 6 and that is coated with an adhesive (not shown) (FIG. 2(a)), layer 5 (FIG. 2(c)), for forming a conductor pattern, thereby printing the pattern for forming the conductor pattern on the photoresist 7, exposed in the third step remains on the conductor layer 5 (FIG. 2(e)) to form a predetermined conductor pattern, and then removing the photoresist, and which the photoresist 7 has been removed (FIG. 2(f)) with tin or the like 12 as required (FIG. 2(g)).
In one embodiment, a protection resist is coated on the rear side of the conductor layer 5, the surface of the conductor layer 5 is etched, and the photoresist 7 and the protection resist are removed.
Referring also to FIG. 3, in the third step in which the photoresist 7 is exposed, using the mask, the following method is often used. A conductor pattern forming pattern 102 representing the shape of the conductor pattern 8 to be exposed is drawn on a glass mask 10. Using this mask, the conductor pattern forming pattern drawn on the mask is exposed on the photoresist 7 of the film carrier, using a lens 13 of, for example, the magnification of 1 to 1 or 1 to 2, developed and fixed, and etching is performed to form the conductor pattern 8.
Connecting sections of the conductor pattern 8, i.e., inner leads, to be connected to an electronic device protrude into the aperture 6, and the inner leads of the conductor pattern 8 are connected to electrodes of an electronic device within the aperture 6. Therefore, considering the position of the electronic device while it is connected and after it has been connected, positioning of the conductor pattern 8 and the aperture 6 is also required. It is noted that the apertures 6 can be formed in the film carrier with high precision by a conventional technique, using the IP reference line as a reference.
The conductor pattern 8 has rod-shaped sections extending from the film into the aperture 6 so that an electronic device is connected thereto. Therefore, if the position of the conductor pattern is deviated from the IP reference coordinates 24 (X axis), 26 (Y axis), when an electronic device is connected to the conductor p
REFERENCES:
patent: 5733708 (1998-03-01), Cantanzaro et al.
patent: 5795687 (1998-08-01), Yasuda
patent: 5856054 (1999-01-01), Tomimatu
Seiko Epson Corporation
Young Christopher G.
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