Method and tooling for z-axis offset of lead frames

Details Method and tooling for z-axis offset of lead frames Method and tooling for z-axis offset of lead frames

2005-08-16

2005-08-16

Crane, Daniel C. (Department: 3725)

Metal deforming

By tool-couple embodying nonplanar tool-face

With complementary tool-faces

C072S472000, C029S874000, C029S882000

Reexamination Certificate

active

06928850

ABSTRACT:
A method and apparatus for enabling z-axis offset of narrow metal ties straps in lead frames used for packaging integrated circuits to prevent bowing or distortion. Simultaneous offsetting of the tie strap and stress relief mechanisms are provided on both the front and back sides of the lead frame. Those mechanisms include indentations along the long or primary axis of each tie strap, coupled with depressions across the top surface both at the center of the lead frame and between the base of the off set and the chip attach locations to prevent bowing in small pad and no pad lead frames, in particular.

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