Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Reexamination Certificate
2000-05-19
2001-03-06
Ryan, Patrick (Department: 1725)
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
By fluid blast or suction
C228S025000, C228S030000, C228S121000, C228S125000, C228S158000, C101S005000, C428S038000, C156S063000
Reexamination Certificate
active
06196440
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates generally to the field of tools and more particularly to a tool for imprinting a pattern in a solder.
BACKGROUND OF THE INVENTION
Panes of stained glass are commonly held together by solder to form a stained glass window. Two panes of stained glass
10
,
12
(See
FIG. 1
) are connected together along a joint line
14
. An edge
16
of the first pane
10
and an edge
18
of the second pane
12
are covered with a copper foil
20
,
22
. The edges
16
,
18
are then abutted and a line of solder
24
is applied to hold the panes
10
,
12
together alone the joint line
14
. By carefully cutting pieces of stained glass so that they abut each other along one edge and then joining the pieces as described above, an artistic stained glass window is formed. Commonly a wood frame is then placed around the outside edges of the panes to finish the window. Since stained glass windows are mainly designed for their aesthetic appearance, artists have tried to pattern the solder on the joint lines. Some artists have formed patterns in the solder by placing little beads of solder on top of the solder forming the joint line. However, this results in a very limited set of patterns that can be formed in the joint lines.
Thus there exists a need for a method and a tool for forming a pattern in a solder.
SUMMARY OF THE INVENTION
A tool for imprinting a pattern in a solder that overcomes these and other problems has a handle. A stamp, connected to the handle, has a pattern formed on a face of the stamp. The face of the stamp forms a concave surface.
REFERENCES:
patent: 3676920 (1972-07-01), Pilditch
patent: 3750265 (1973-08-01), Cushman
patent: 4016810 (1977-04-01), Szikla
patent: 4255475 (1981-03-01), DelGrande
patent: 4312688 (1982-01-01), Brodis et al.
patent: 4600466 (1986-07-01), Herrmann
patent: 4619850 (1986-10-01), Charlton
patent: 4690852 (1987-09-01), Hull
patent: 4880485 (1989-11-01), Lewis et al.
patent: 5111572 (1992-05-01), Haiml et al.
patent: 5116174 (1992-05-01), Fried et al.
patent: 5350105 (1994-09-01), Delalle et al.
patent: 5611144 (1997-03-01), Gusky
patent: 5789066 (1998-08-01), De Mare et al.
Halling Dale B.
Ryan Patrick
Stoner Kiley
LandOfFree
Method and tool for imprinting a pattern in a solder does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and tool for imprinting a pattern in a solder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and tool for imprinting a pattern in a solder will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2488657