Method and tool for imprinting a pattern in a solder

Details Method and tool for imprinting a pattern in a solder Method and tool for imprinting a pattern in a solder

1997-11-04

2000-10-24

Ryan, Patrick

Metal fusion bonding

Process

Bonding nonmetals with metallic filler

228125, 101 6, 72191, 428 38, B23K 3102, B23K 3100, B31F 107, B44C 508

Patent

active

061353426

ABSTRACT:
A tool (40) for imprinting a pattern in a has a handle (42). A stamp (44), connected to the handle (42), has a pattern (54) formed on a face (52) of the stamp (44). The face (52) of the stamp (44) forms a concave surface.

REFERENCES:
patent: 3750265 (1973-08-01), Cushman
patent: 4312688 (1982-01-01), Brodis et al.
patent: 4600466 (1986-07-01), Herrmann
patent: 4619850 (1986-10-01), Charlton
patent: 4690852 (1987-09-01), Hull
patent: 4880485 (1989-11-01), Lewis et al.
patent: 5111572 (1992-05-01), Haiml et al.
patent: 5789066 (1998-08-01), De Mare et al.
The Metals Handbook Ninth Edition, vol. 14, (pp. 184-186, 321, 346-347, 352, 512-515, 629-630, 792-796, 801, 804, and 896-897), 1988.

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