Method and tool for handling micro-mechanical structures

Details Method and tool for handling micro-mechanical structures Method and tool for handling micro-mechanical structures

1997-08-07

1999-10-12

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438113, 438462, 438464, H01L 2144

Patent

active

059665912

ABSTRACT:
A method of forming and handling an array of micro-devices such as thin film devices that enables simultaneous mass handling and processing of these thin film devices. A plurality of micro-devices and links are simultaneously formed on a wafer, with the links interconnecting the micro-devices for maintaining a unitary array structure. A matrix of magnetic strips is then formed to impart added overall tensile strength to the array. The magnetic strips are secured to the links and form a planar support grid therewith. The array of micro-devices is then released from the wafer and lifted therefrom by means of a magnetic pick-up tool. Using the pick-up tool, the array is transferred onto a magnetic chuck which securely retains the array. Conductive wires are bonded to a row of micro-devices devices which are then separated from the array into individual micro-devices.

REFERENCES:
patent: 3770531 (1973-11-01), Craft et al.
patent: 5174012 (1992-12-01), Hamilton
patent: 5185292 (1993-02-01), Van Vonne et al.
patent: 5275958 (1994-01-01), Ishikawa
patent: 5479694 (1996-01-01), Baldwin
patent: 5567332 (1996-10-01), Mehta

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