Method and tool for assembling power semiconductor and heat sink

Details Method and tool for assembling power semiconductor and heat sink Method and tool for assembling power semiconductor and heat sink

1987-10-16

1988-08-30

Sakran, Victor N.

Buckles, buttons, clasps, etc.

Clasp, clip, support-clamp, or required component thereof

Having gripping member formed from, biased by, or mounted on...

24 6711, 24573, 403 12, A44B 2100

Patent

active

047666536

ABSTRACT:
Transistors are sandwiched between two heat sinks which, in turn, are bolted together to form a transistor-heat sink assembly. The transistors are properly positioned between the heat sinks prior to the latter being bolted together by being clipped onto one of the heat sinks by spring clips. The spring clip has a concave end which embraces the transistor, which has a round configuration. Spring fingers flank the concave end of the clip and bear against a flange on the side of the transistor. The clip has a U-shaped portion distal of the concave end which slips over one of the fins on the heat sink, whereby the transistor is temporarily held in place on the heat sink. After assembly, the clips can be slipped off of the assembled combination without disturbing the latter.

REFERENCES:
patent: 1283037 (1918-10-01), Baltzley
patent: 1372628 (1921-03-01), Mueller et al.
patent: 1675286 (1928-06-01), Van Valkenburg
patent: 1817424 (1931-08-01), Smiley
patent: 2007431 (1935-07-01), Malcom
patent: 2012422 (1935-08-01), Fanger
patent: 3348272 (1967-10-01), Germani

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