Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-12-27
2008-11-25
Datskovskiy, Michael V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S689000, C361S699000, C165S080300, C165S080400, C165S104330, C165S185000, C062S259200, C174S015100
Reexamination Certificate
active
07457116
ABSTRACT:
A method, apparatus, and system related to thermal management. The method includes reducing a temperature of a stream of air upstream of at least one memory module by a heat absorption component of a refrigeration device, moving the stream of air into contact with at least one surface of the at least one memory module and transferring heat provided by the at least one memory module and a heat rejection component of the refrigeration device to a location downstream of the at least one memory module.
REFERENCES:
patent: 4352274 (1982-10-01), Anderson et al.
patent: 5706668 (1998-01-01), Hilpert
patent: 6205796 (2001-03-01), Chu et al.
patent: 6305180 (2001-10-01), Miller et al.
patent: 6422304 (2002-07-01), Slovikosky
patent: 6438984 (2002-08-01), Novotny et al.
patent: 6467295 (2002-10-01), Oh et al.
patent: 6493223 (2002-12-01), Viswanath et al.
patent: 6587343 (2003-07-01), Novotny et al.
patent: 6591898 (2003-07-01), Chu et al.
patent: 6628520 (2003-09-01), Patel et al.
patent: 6925829 (2005-08-01), Wei
patent: 6997006 (2006-02-01), Kameyama et al.
patent: 7002799 (2006-02-01), Malone et al.
patent: 7164580 (2007-01-01), DiStefano
patent: 7203063 (2007-04-01), Bash et al.
patent: 7252139 (2007-08-01), Novotny et al.
patent: 7278467 (2007-10-01), Huang et al.
patent: 2002/0105779 (2002-08-01), Lei et al.
patent: 2005/0061013 (2005-03-01), Bond
patent: 2006/0028800 (2006-02-01), Chrysler et al.
patent: 401270296 (1989-10-01), None
Chrysler Gregory M.
Erturk Hakan
Sauciuc Ioan
Buckley Maschoff & Talwalkar LLC
Datskovskiy Michael V
Intel Corporation
LandOfFree
Method and system to cool memory does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and system to cool memory, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and system to cool memory will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4040296