Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2008-04-15
2008-04-15
Bella, Matthew C. (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C315S293000
Reexamination Certificate
active
07359545
ABSTRACT:
An after develop inspection tool considers tool-to-tool variability when determining confidence score for wafers under inspection. A golden wafer is used to calculate a RGB signature as well as the slope of the individual RGB curves for different lamp intensities. These slopes are normalized in order to generate a compensation factor for red values and blue values within a signature. When a wafer is subsequently inspected at an ADI station using a different lamp, the test wafer RGB signature is likely captured at a different lamp intensity. Consequently, when comparing the signatures, the golden wafer RGB signature is adjusted by the compensation factors, based on the different lamp's intensity setting, and this adjusted RGB signature is then used to determine whether a defect exists on the test wafer.
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Miller, J.G. et al.,Implementing a Fully Automatic Macro Defect Detection and Classification System in a High-Production Semiconductor Fab, Journal of Microlithography, Macrofabrication, and Microsystems, vol. 2, No. 1, Jan. 2003.
Dixon David
Lee Lloyd
Bella Matthew C.
Rosario Dennis
Tokyo Electron Limited
Wood Herron & Evans L.L.P.
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