Method and system of trace pull test

Details Method and system of trace pull test Method and system of trace pull test

2007-03-14

2008-11-04

Nguyen, Ha (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07446546

ABSTRACT:
The present invention provides an efficient test method and system for testing the IC package, such as BGA types of packages. With the present invention, manufacturer can have an easier way in testing various types of packages, including newer types. Manufacturer also can get the testing outcome which is more accurate. Furthermore, the present invention helps the manufacturer to achieve a significant improvement in IC packaging process.

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