Method and system of tape automated bonding

Details Method and system of tape automated bonding Method and system of tape automated bonding

2007-03-13

2007-03-13

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S702000, C257S666000, C257S668000, C257S724000, C257SE23066

Reexamination Certificate

active

09970145

ABSTRACT:
A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.

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