Method and system for temperature control of a substrate

Details Method and system for temperature control of a substrate Method and system for temperature control of a substrate

2007-06-12

2007-06-12

Paschall, Mark (Department: 3742)

Electric heating

Metal heating

By arc

C219S486000, C219S483000, C324S763010, C118S724000, C156S345520

Reexamination Certificate

active

10551236

ABSTRACT:
A substrate holder for supporting a substrate in a processing system and controlling the temperature thereof is described. The substrate holder comprises a first heating element positioned in a first region for elevating the temperature of the first region. A second heating element positioned in a second region is configured to elevate the temperature in the second region. Furthermore, a first controllably insulating element is positioned below the first heating element, and is configured to control the transfer of heat between the substrate and at least one cooling element positioned therebelow in the first region. A second controllably insulating element is positioned below the second heating element and is configured to control the transfer of heat between the substrate and at least one cooling element positioned therebelow in the second region.

REFERENCES:
patent: 5420521 (1995-05-01), Jones
patent: 5958140 (1999-09-01), Arami et al.
patent: 6080969 (2000-06-01), Goto et al.
patent: 6084215 (2000-07-01), Furuya et al.
patent: 6639189 (2003-10-01), Ramanan et al.
patent: 6847014 (2005-01-01), Benjamin et al.
patent: 6886976 (2005-05-01), Gaasch et al.

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