Method and system for stacking integrated circuits

Details Method and system for stacking integrated circuits Method and system for stacking integrated circuits

2011-01-04

2011-01-04

Fahmy, Wael M (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S692000, C257S698000, C257S777000, C257SE25013, C438S109000

Reexamination Certificate

active

07863720

ABSTRACT:
A method and system for stacking integrated circuits is described. An integrated circuit stack is formed by stacking integrated circuit pairs. The integrated circuit pairs are formed by connecting an active surface of a first integrated circuit to an active surface of a second integrated circuit using flip chip bonding. The first integrated circuit pair is connected to a substrate using an adhesive. The other integrated circuit pairs are stacked sequentially on the first integrated circuit pair using an adhesive. Wire bonding is used to connect the second integrated circuit in each of the integrated circuit pairs to the substrate.

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