Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2007-08-21
2009-12-08
Nhu, David (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S780000, C257SE21170, C257SE21229, C257SE21304, C257SE21502, C257SE21503, C257SE21509, C257SE21511
Reexamination Certificate
active
07629678
ABSTRACT:
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, where the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method includes forming a metal seal on the substrate proximate a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.
REFERENCES:
patent: 3704806 (1972-12-01), Plachenov et al.
patent: 3900440 (1975-08-01), Ohara et al.
patent: 4036360 (1977-07-01), Deffeyes
patent: 4074480 (1978-02-01), Burton
patent: 4431691 (1984-02-01), Greenlee
patent: 4531126 (1985-07-01), Sadones
patent: 4552806 (1985-11-01), Hayashi et al.
patent: 4950344 (1990-08-01), Glover et al.
patent: 4954789 (1990-09-01), Sampsell
patent: 4977009 (1990-12-01), Anderson et al.
patent: 5018256 (1991-05-01), Hornbeck
patent: 5075796 (1991-12-01), Schildkraut et al.
patent: 5091983 (1992-02-01), Lukosz
patent: 5095375 (1992-03-01), Bolt
patent: 5099353 (1992-03-01), Hornbeck
patent: 5172262 (1992-12-01), Hornbeck
patent: 5212582 (1993-05-01), Nelson
patent: 5216537 (1993-06-01), Hornbeck
patent: 5244707 (1993-09-01), Shores
patent: 5293511 (1994-03-01), Poradish et al.
patent: 5304419 (1994-04-01), Shores
patent: 5381253 (1995-01-01), Sharp et al.
patent: 5547823 (1996-08-01), Murasawa et al.
patent: 5550373 (1996-08-01), Cole et al.
patent: 5553440 (1996-09-01), Bulger et al.
patent: 5559358 (1996-09-01), Burns et al.
patent: 5591379 (1997-01-01), Shores
patent: 5646729 (1997-07-01), Koskinen et al.
patent: 5703710 (1997-12-01), Brinkman et al.
patent: 5739945 (1998-04-01), Tayebati
patent: 5815141 (1998-09-01), Phares
patent: 5835255 (1998-11-01), Miles
patent: 5853662 (1998-12-01), Watanabe
patent: 5939785 (1999-08-01), Klonis et al.
patent: 5986796 (1999-11-01), Miles
patent: 6040937 (2000-03-01), Miles
patent: 6055090 (2000-04-01), Miles
patent: 6238755 (2001-05-01), Harvey et al.
patent: 6355328 (2002-03-01), Baratuci et al.
patent: 6455927 (2002-09-01), Glenn et al.
patent: 6467139 (2002-10-01), Tanaka
patent: 6489670 (2002-12-01), Peterson et al.
patent: 6495895 (2002-12-01), Peterson et al.
patent: 6538312 (2003-03-01), Peterson et al.
patent: 6582789 (2003-06-01), Sumi
patent: 6589625 (2003-07-01), Kothari et al.
patent: 6603182 (2003-08-01), Low et al.
patent: 6621134 (2003-09-01), Zurn
patent: 6650455 (2003-11-01), Miles
patent: 6661084 (2003-12-01), Peterson et al.
patent: 6674159 (2004-01-01), Peterson et al.
patent: 6674562 (2004-01-01), Miles et al.
patent: 6680792 (2004-01-01), Miles
patent: 6709750 (2004-03-01), Pohlmann et al.
patent: 6743656 (2004-06-01), Orcutt et al.
patent: 6791660 (2004-09-01), Hayashi et al.
patent: 6838309 (2005-01-01), McCann
patent: 6867896 (2005-03-01), Miles
patent: 6872984 (2005-03-01), Leung
patent: 6999225 (2006-02-01), Lin et al.
patent: 7012726 (2006-03-01), Miles
patent: 7012732 (2006-03-01), Miles
patent: 7015885 (2006-03-01), Novotny et al.
patent: 7034984 (2006-04-01), Pan et al.
patent: 7042643 (2006-05-01), Miles
patent: 7060895 (2006-06-01), Kothari et al.
patent: 7119945 (2006-10-01), Kothari et al.
patent: 7123216 (2006-10-01), Miles
patent: 7126741 (2006-10-01), Wagner et al.
patent: 7138984 (2006-11-01), Miles
patent: 7164520 (2007-01-01), Palmateer et al.
patent: 7259449 (2007-08-01), Floyd
patent: 7307776 (2007-12-01), Miles et al.
patent: 7317281 (2008-01-01), Hayashi et al.
patent: 7385748 (2008-06-01), Miles
patent: RE40436 (2008-07-01), Kothari et al.
patent: 7471444 (2008-12-01), Miles
patent: 2002/0000649 (2002-01-01), Tilmans et al.
patent: 2002/0056900 (2002-05-01), Liu et al.
patent: 2002/0075551 (2002-06-01), Daneman
patent: 2002/0075555 (2002-06-01), Miles
patent: 2002/0121909 (2002-09-01), Sato et al.
patent: 2002/0126364 (2002-09-01), Miles
patent: 2002/0160583 (2002-10-01), Song
patent: 2002/0187254 (2002-12-01), Ghosh
patent: 2003/0053233 (2003-03-01), Felton
patent: 2003/0054588 (2003-03-01), Patel et al.
patent: 2003/0062186 (2003-04-01), Boroson et al.
patent: 2003/0075794 (2003-04-01), Felton et al.
patent: 2003/0103185 (2003-06-01), Kim et al.
patent: 2003/0104651 (2003-06-01), Kim et al.
patent: 2003/0108306 (2003-06-01), Whitney et al.
patent: 2003/0155643 (2003-08-01), Freidhoff
patent: 2003/0183916 (2003-10-01), Heck et al.
patent: 2003/0184412 (2003-10-01), Gorrell
patent: 2003/0214007 (2003-11-01), Tao et al.
patent: 2004/0048037 (2004-03-01), Klausmann et al.
patent: 2004/0061492 (2004-04-01), Lopes et al.
patent: 2004/0066258 (2004-04-01), Cohn et al.
patent: 2004/0070706 (2004-04-01), Freeman
patent: 2004/0100677 (2004-05-01), Huibers et al.
patent: 2004/0140557 (2004-07-01), Sun et al.
patent: 2004/0184133 (2004-09-01), Su et al.
patent: 2005/0023976 (2005-02-01), Wang
patent: 2005/0036192 (2005-02-01), Lin et al.
patent: 2005/0042117 (2005-02-01), Lin
patent: 2005/0046919 (2005-03-01), Taguchi et al.
patent: 2005/0046922 (2005-03-01), Lin et al.
patent: 2005/0074919 (2005-04-01), Patel et al.
patent: 2005/0093134 (2005-05-01), Tarn
patent: 2005/0167795 (2005-08-01), Higashi
patent: 2005/0253283 (2005-11-01), Dcamp et al.
patent: 2005/0254115 (2005-11-01), Palmateer
patent: 2006/0152106 (2006-07-01), Yan et al.
patent: 2006/0197215 (2006-09-01), Potter
patent: 2007/0097477 (2007-05-01), Miles
patent: 1 093 162 (2001-04-01), None
patent: 1 418 154 (2004-05-01), None
patent: 2841380 (2003-12-01), None
patent: 59-6842 (1984-01-01), None
patent: 04-085859 (1992-03-01), None
patent: 11-145337 (1999-05-01), None
patent: WO 01/45140 (2001-06-01), None
patent: WO 02/42716 (2002-05-01), None
patent: WO 03/009318 (2003-01-01), None
patent: WO 03/026369 (2003-03-01), None
patent: WO 03/105198 (2003-12-01), None
patent: WO 2004/025727 (2004-03-01), None
patent: WO 2005/114294 (2005-12-01), None
Jung et al., Soldered sealing process to assemble a protective cap for a MEMS CSP, Design, Test, Integration and Packaging of MEMS/MOEMS 2003 Symposium, pp. 255-260.
Kim et al., Fabrication and characteriziation of a low-temperature hermetic MEMS package bonded by a closed loop AuSn solder-line, Proceedings of the IEEE 16th Annual International Conference on Micro Electro Mechanical Systems, Jan. 2003, pp. 614-617.
Liang, Zhi-Hao et al., “A Low Temperature Wafer-Level Hermetic MEMS Package Using UV Curable Adhesive”, Electronic Components and Technology Conference, 2004 IEEE, pp. 1486-1491.
Maharbiz et al., Batch micropackaging by compression-bonded wafer-wafer transfer, Twelfth IEEE International Conference on Micro Electro Mechanical Systems, Jan. 17-21, 1999, pp. 482-489.
Moraja, et al., Advanced Getter Solutions at Wafer Level to Assure High Reliability to the last Generations MEMS, IEEE Reliability Physics Symposium Proceedings, 2003, pp. 458-459.
Sparks, et al. Chip-Level Vacuum Packaging of Micromachines Using NanoGetters, IEEE Transactions on Advanced Packaging, vol. 26 Issue 3, Aug. 2003, pp. 277-282.
Tao et al., Selective Bonding and encapsulation for wafer-level vacuum packaging of mems and related micro systems, Microelectronics and Reliability, 44(2):251-258, Feb. 2004.
Tilmans et al., The indent reflow sealing (IRS) technique—A method for the fabrication of sealed cavities for mems devices, Journal of Microelectromechanical Systems, 9(2), Jun. 2000.
Tominetti, et al., Moisture and impurities detection and removal in packaged MEMS, Proceedings of the SPIE, Reliability, Testing and Characterization of MEMS/MOEMS, Oct. 2001, pp. 215-225.
Yang et al., Localized induction heating solder bonding for wafer level MEMS packaging, 17th IEEE International Conference on Micro Electro Mechanical Systems, Jan. 2004, pp. 729-732.
Office Action dated Dec. 22, 2006 in U.S. Appl. No. 11/089,769.
Extended European Search Report for App. No. 05255659.4, dated Nov. 6, 2007.
Office Action in Chinese App. No. 200510103553.0, dated M
Knobbe Martens Olson & Bear LLP
Nhu David
Qualcomm Mems Technologies, Inc.
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