Method and system for reworkable direct chip attach (DCA) struct

Details Method and system for reworkable direct chip attach (DCA) struct Method and system for reworkable direct chip attach (DCA) struct

1995-09-19

1998-06-23

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156344, 2940208, 228191, 228264, 428458, 428901, 438118, B32B 3500

Patent

active

057699895

ABSTRACT:
A configuration of surface-mounted circuit assembly has four layers, namely, an integrated circuit device, an adhesive layer, a solder layer and the carrier board. The integrated circuit device is attached to the solder layer which sets on top of the carrier board, with the adhesive layer between the integrated circuit device and the solder layer. The carrier board has at least one via located beneath where the integrated circuit is located. The via is filled with solder such that the solder layer at which the integrated circuit device is situated is thermo-conductively connected to the back side of the carrier board. This configuration allows the integrated circuit device to be easily removed from the carrier board by the application of heat to the back side of the carrier board.

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