Method and system for reproducing relief structures onto a subst

Plastic and nonmetallic article shaping or treating: processes – Forming continuous or indefinite length work – Of varying cross-sectional area or with intermittent...

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425363, 425373, 425808, 425810, B30B 1114

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active

045432252

ABSTRACT:
Method for reproducing relief structures onto a substrate, whereby between a die surface comprising holes or protuberances corresponding to the negative shape of the relief to be reproduced, and a substrate a hardenable liquid is deposited. After depositing the die surface and the substrate are at least locally forced together whereby the respective section of the die surface does not move in relation to the substrate in any other direction than perpendicular to the contact surface. During the following hardening of said liquid there is no mutual movement between the die surface and the substrate both of which remain forced together with a pressure which is smaller than the pressure during the initial pressing stage. The substrate and the die surface are separated after the liquid is hardened. There are significant differences in the chemical or physical parameters which have influence onto the hardening process between those liquid parts forming the higher relief parts and those liquid parts forming the lower relief parts.

REFERENCES:
patent: 3241182 (1966-03-01), Kessler
patent: 3246365 (1966-04-01), Kloender
patent: 3265776 (1966-08-01), Henkes
patent: 3507939 (1970-04-01), Williams et al.
patent: 3860382 (1975-01-01), Skiller et al.
patent: 3873255 (1975-03-01), Kalwaites
patent: 3874836 (1975-04-01), Johnson et al.
patent: 3893795 (1975-07-01), Nauta
patent: 4211743 (1980-07-01), Nauta et al.
patent: 4290248 (1981-09-01), Kemerer et al.
patent: 4312823 (1982-01-01), Kraakman et al.
patent: 4395211 (1983-07-01), Broeksema et al.

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