Method and system for removing resin bleed from electronic compo

Details Method and system for removing resin bleed from electronic compo Method and system for removing resin bleed from electronic compo

1991-02-13

1993-02-16

Valentine, Donald R.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

204203, 204226, 204227, C25F 500, C25F 700, C25D 1728

Patent

active

051867974

ABSTRACT:
Disclosed is an in-line electrolytic deflash system and method for removing resin bleed and other materials from the leads of an encapsulated electronic component. An encapsulated electronic component is carried on a continuous belt through the system. The component first passes through an electrolytic deflash station which includes tanks filled with a deflash solution for loosening the resin bleed. The component is then rinsed in a low pressure rinse station, and then carried through a high pressure rinse station where the loosened resin bleed is removed from the component. The component is then further rinsed with both tap water and a deionized water. Once the component has been sufficiently rinsed any remaining moisture is blown off the part in an air knife station and the component is then passed through a dryer which completely removes any moisture remaining on the component.

REFERENCES:
patent: 4508611 (1985-04-01), Johnson et al.
patent: 4534843 (1985-08-01), Johnson et al.
patent: 4859298 (1989-08-01), Senge et al.
patent: 4906345 (1990-03-01), Gramarossa et al.
patent: 4966664 (1990-10-01), Buerk et al.
patent: 4968397 (1990-11-01), Asher et al.
patent: 4968398 (1990-11-01), Ogasawara

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