Refrigeration – Using electrical or magnetic effect – Thermoelectric; e.g. – peltier effect
Reexamination Certificate
2007-09-19
2010-06-22
Denion, Thomas E (Department: 3748)
Refrigeration
Using electrical or magnetic effect
Thermoelectric; e.g., peltier effect
C062S259200, C062S003700
Reexamination Certificate
active
07739877
ABSTRACT:
A thermoelectric cooler apparatus for a fiber optic system includes a first plate coupled to the fiber optic system and a second plate for coupling to a heat sink. The apparatus includes a first plurality of thermoelectric units and a second plurality of thermoelectric units being sandwiched between the first plate and the second plate for enhancing or retarding a heat transfer between the first plate and the second plate. The first plurality of thermoelectric units is connected to each other electrically in series. The second plurality of thermoelectric units is connected to each other electrically in series but insulated from the first plurality of thermoelectric units. The first plurality of thermoelectric units and the second plurality of thermoelectric units are configured such that a cross-section of the apparatus includes one or more of the second plurality of thermoelectric units being sandwiched by the first plurality of thermoelectric units.
REFERENCES:
patent: 3204418 (1965-09-01), Mathews
patent: 5349821 (1994-09-01), Schrage
patent: 6377725 (2002-04-01), Stevens et al.
patent: 6539725 (2003-04-01), Bell
patent: 6556752 (2003-04-01), Fang et al.
patent: 2001/0052234 (2001-12-01), Venkatasubramanian
patent: 2004/0081410 (2004-04-01), Aronson et al.
patent: 2005/0100290 (2005-05-01), Huang
patent: 2005/0210883 (2005-09-01), Bell
patent: 1287542 (2001-03-01), None
patent: 1 436 931 (2005-12-01), None
patent: 6 -89955 (1994-03-01), None
Huang et al., “Performance and Reliability of Redundant Thermoelectric Coolers”, Electronic Components and Technology Conference, 1991. Proceedings., 41st volume , Issue , May 11-16, 1991 pp. 34-37.
Hashimoto et al., “Multichip Optical Hybrid Integration Technique with Planar Lightwave Circuit Platform”, Journal of Lightwave Technology, vol. 6, No. 7, Jul. 1998.
Henry et al., “Glass Waveguides on Siliconfor Hybrid Optica; Packaging”, Journal of Lightwave Technology, vol. 7, No. 10, Oct. 1999.
Ohyama et al., “4-Channel x 10-Gbit/s Hybrid INTEGRATED Multiwavelength Laser Module Using Silica-Based Planar Lightwave Circuit Platform with 1.5%Δ”, Conference: European conference on optical communication; ECOC 2002—28th European Conference on Optical Communication , 2002; 28th Conf; vol. 2 p. 5.4.1; COM, Technical University of Denmark,, 2002 Sponsor: Danmarks tekniske universitet Location: Copenhagen, Denmark, 2002; Sep.
Lackovic et al., “Sensitivity Analysis of Component Failures in the Switched WDM Network”, In Proceedings of Optical Networking Design and Modeling (ONDM) (Ghent, Belgium, Feb. 2-4, 2004), pp. 205-224.
Nagarajan et al., “Large -Scale Photonic Integrated Circuits”, IEEE Journal of Selected Topics in Quantum Electronics, vol. 11, No. 1, Jan./ Feb. 2005.
International Search Report and Written Opinion of PCT Application No. PCT/CN2007/071128, date of mailing Mar. 20, 2008, 14 pages total.
Bai Yu Sheng
Shen Xiao Andy
Carton Michael
Denion Thomas E
FutureWei Technologies, Inc.
Townsend and Townsend and Crew
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