Method and system for reducing water vapor in integrated circuit

Details Method and system for reducing water vapor in integrated circuit Method and system for reducing water vapor in integrated circuit

1999-03-11

2000-04-25

Pelham, Joseph

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

221 71, 221150A, 2221465, 34625, F26B 1310, F27B 319, F27B 914

Patent

active

060546824

ABSTRACT:
A system and method for assembling components onto a circuit board is disclosed. The system includes: a thermal chamber for receiving a plurality of components therein and for heating the plurality of components at a predetermined temperature for a predetermined length of time; an outfeed slot located on a wall of the thermal chamber which allows at least one component from the plurality of components to pass therethrough and emerge externally of the thermal chamber; and a pick and place machine, located adjacent to the thermal chamber, which automatically retrieves the at least one component which has passed through the outfeed slot and automatically places the at least one component onto a designated circuit board. The method includes: placing at least one component into an interior chamber of a thermal oven; heating the at least one component at a predetermined temperature within the thermal oven for a predetermined length of time; passing the at least one component through an outfeed slot located on a wall of the thermal oven, at the expiration of the predetermined length of time, such that the at least one component emerges externally of the thermal oven; and retrieving the at least one component which emerges from the thermal oven through the outfeed slot with an automated pick and place machine which thereafter places the at least one component onto a designated circuit board.

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