Method and system for reducing semiconductor wafer breakage

Details Method and system for reducing semiconductor wafer breakage Method and system for reducing semiconductor wafer breakage

2005-08-23

2005-08-23

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S109000, C700S110000, C700S114000, C700S121000, C451S287000, C451S288000, C451S289000, C451S009000

Reexamination Certificate

active

06934595

ABSTRACT:
In a system and method to reduce wafer breakages in a wafer handling system, the position of a wafer on a platen is monitored and closing of the platen on a vacuum chamber is prevented if a misaligned wafer is detected. In one embodiment the wafer position is monitored by monitoring the air pressure in vacuum channels of a platen faceplate.

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patent: 6211945 (2001-04-01), Baxter et al.
patent: 2002/0027433 (2002-03-01), Dunklee

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