Method and system for reducing crosstalk in a backplane

Electrical connectors – Electromagnetic or electrostatic shield – Multi-part shield body

Reexamination Certificate

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Reexamination Certificate

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06908340

ABSTRACT:
A method and system for configuring the transmit and receive elements or structures in connector such that crosstalk can be reduced. The connector connects serdes modules in first PCB to serdes modules in one or more second PCBs via a backplane. The connector includes: first and second transmit connection positions in a first direction; first and second receive connection positions; and a ground shield positioned in the first direction between the first and second transmit connection positions and the first and second receive connection positions, wherein the first and second transmit connection positions do not have an interposing ground shield in another direction.

REFERENCES:
patent: 5397861 (1995-03-01), Urquhart, II
patent: 6384341 (2002-05-01), Rothermel et al.
patent: 6527587 (2003-03-01), Ortega et al.
Gautam Patel, Kevin Ryan; “Designing 3.125 Gbps Backplane Systems”; presented in Munich Germany at Electronica Conference on Nov. 13, 2002; pp. 1-29.
Matt Shafer, Bodhi Das, Gautam Patel; “Connector and Chip Vendors Unite to Produce a High-Performance 10 Gb/s NRZ-Capable Serial Backplane”; presented on Jan. 27-30 in Santa Clara, California; DesignCon 2003 High-Performance System Design Conference; 19 pages.
Teradyne Connection Systems; “GbX Drawings”; downloaded from http://www.teradyne.com/prods/tcs/products/connectors/backplane/gbx/drawings.html; Jul. 27, 2003; 7 pages.
Teradyne Connection Systems; GbX Configuration; downloaded from http://www.teradyne.com/prods/tcs/products/connectors/backplane/gbx/modconfig.html; Jul. 27, 2003; 1 page.

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