Method and system for providing backside voltage contrast...

Semiconductor device manufacturing: process – With measuring or testing

Reexamination Certificate

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C438S016000, C438S017000, C438S151000

Reexamination Certificate

active

06991946

ABSTRACT:
The present inventive principles provide a method and system for performing backside voltage contrast on an SOI device. The SOI semiconductor device includes a bulk silicon, a box insulator residing on the bulk silicon and a silicon region on the box insulator. The SOI semiconductor device further includes a plurality of structures in the silicon region, the plurality of structures includes a conductive structure. The method and system include mechanical dimpling and chemical etching of the substrate to expose the box insulator. Optionally, a second chemical etch to remove at least a portion of the box insulator may be performed. A charged particle beam, such as energetic electrons from an SEM, for example, may be directed at the backside of the device, and emitted secondary electrons observed.

REFERENCES:
patent: 6201240 (2001-03-01), Dotan et al.
patent: 6236222 (2001-05-01), Sur et al.
patent: 6300147 (2001-10-01), Naruoka
patent: 6451668 (2002-09-01), Neumeier et al.
patent: 6521512 (2003-02-01), Vasquez
patent: 6770495 (2004-08-01), Ang et al.

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