Optics: measuring and testing – Position or displacement – Triangulation
Reexamination Certificate
2007-11-07
2009-11-10
Lyons, Michael A (Department: 2877)
Optics: measuring and testing
Position or displacement
Triangulation
C356S614000
Reexamination Certificate
active
07616328
ABSTRACT:
A triangulation system including a laser beam, optics focusing the laser beam on an object, a light detection unit detecting light reflected from the object due to impingement of the beam on the object, and an arrangement for determining, based on the detected light, object feature dimensions. The wavelength of the laser beam may be shorter than of infrared radiation, which allows for a reduced spot size without significant loss of depth of field. So as to reduce aberrations or a sensitivity to aberrations due to the shortened wavelength, the system may include (i) a polarization dependent coating matching the index of refraction of an element of the light detection unit to that of air for a range of angles, (ii) tilted projection optics, (iii) a prism wavefront corrector, and/or (iv) a positioning assembly, which provides for increased precision in positioning the laser diode with respect to a collimator lens.
REFERENCES:
patent: 4238147 (1980-12-01), Stern
patent: 4627734 (1986-12-01), Rioux
patent: 5517349 (1996-05-01), Sandstrom
patent: 5554858 (1996-09-01), Costa et al.
patent: 5668894 (1997-09-01), Hamano et al.
patent: 5859924 (1999-01-01), Liu et al.
patent: 6028671 (2000-02-01), Svetkoff
patent: 6031225 (2000-02-01), Stern et al.
patent: 6144453 (2000-11-01), Hallerman et al.
patent: 6262803 (2001-07-01), Hallerman et al.
patent: 6291816 (2001-09-01), Liu
patent: 7075662 (2006-07-01), Hallerman et al.
patent: 2005/0057757 (2005-03-01), Colonna De Lega et al.
patent: 2005/0068540 (2005-03-01), De Groot et al.
Vodanovic, B., “3D Inspection of bumped wafers in production.” Chip Scale Review (Oct. 2005) pp. 45-48.
Masi, C. G. “Vision system simultaneously checks 2- and 3-D images of wafer bumps and flip-chip substrates,” Vision Systems Design (Oct. 2006) at http://vsd.pennnet.com/display—article 274259/19/ARTCL
one
one/Inspection—speeds—wafer—production (pp. 1-5).
A copy of PCT Search Report (mailed Oct. 9, 2008); 12 pgs.
Drannbauer James
Krichever Mark
Lawrence Murray
Stern Howard
Dicke Billig & Czaja, PLLC
Lyons Michael A
Rudolph Technologies, Inc.
Ton Tri T
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