Method and system for processing semiconductor wafers

Details Method and system for processing semiconductor wafers Method and system for processing semiconductor wafers

2006-12-05

2006-12-05

Williams, Hezron (Department: 2856)

Measuring and testing

Testing of apparatus

C134S021000

Reexamination Certificate

active

07143660

ABSTRACT:
A method for processing semiconductor wafers includes processing a semiconductor wafer in a processing chamber having upper and lower chambers, decoupling the upper chamber from the lower chamber, cleaning the upper chamber, determining, while decoupled, that a leak rate and a particle count for the upper chamber meets predetermined criteria, and coupling the upper chamber to the lower chamber.

REFERENCES:
patent: 5690795 (1997-11-01), Rosenstein et al.
patent: 5834827 (1998-11-01), Miyasaka et al.
patent: 6322716 (2001-11-01), Qiao et al.
patent: 6723172 (2004-04-01), Mayes
patent: 2002/0073925 (2002-06-01), Noble et al.

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