Cleaning and liquid contact with solids – Processes – Combined
Reexamination Certificate
2001-08-02
2004-04-20
Markoff, Alexander (Department: 1746)
Cleaning and liquid contact with solids
Processes
Combined
C134S021000, C134S022180, C134S902000, C438S905000
Reexamination Certificate
active
06723172
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
This invention relates generally to the field of semiconductors and, more specifically, to a method and system for processing semiconductor wafers.
BACKGROUND OF THE INVENTION
Many fabrication techniques are used for processing semiconductor wafers. One such fabrication technique is plasma etching. The plasma etch process is usually performed in a processing chamber. There are many requirements for processing chambers used for plasma etching and other semiconductor wafer fabrication processes. For example, it is important that vacuum leak rates and particle counts be at, or within, certain levels. Furthermore, processing chambers used for semiconductor wafer processing usually need to be cleaned after they are used. Therefore, semiconductor fabricators strive to process semiconductor wafers at low cost and in a fast and efficient manner.
One way of preparing processing chambers for use is to disassemble them and clean all the parts with a solvent such as alcohol. The processing chamber is then reassembled, coupled to a lower chamber that houses the processing equipment, and then a vacuum is pulled on the processing chamber. Leak rates and particle counts can then be measured to see if they are within acceptable levels. If they are not within acceptable levels, then the processing chamber is taken off the lower chamber and cleaned further. This wastes considerable time and manpower. Another way of cleaning processing chambers is to outgas them in an oven using, for example, a nitrogen gas. Once again, the processing chamber is placed on the lower chamber and the testing of the leak rates and particle counts is performed as described above. What is needed is a method or system to ensure a preconditioned processing chamber before the processing chamber is set up on the lower chamber before being used for processing semiconductor wafers.
SUMMARY OF THE INVENTION
The challenges in the field of semiconductors continue to increase with demands for more and better techniques having greater flexibility and adaptability. Therefore, a need has arisen for a new method and system for processing semiconductor wafers.
In accordance with the present invention, a method and system for processing semiconductor wafers is provided that addresses disadvantages and problems associated with previously developed methods and systems.
A method for processing semiconductor wafers includes processing a semiconductor wafer in a processing chamber having upper and lower chambers, decoupling the upper chamber from the lower chamber, cleaning the upper chamber, determining, while decoupled, that a leak rate and a particle count for the upper chamber meets predetermined criteria, and coupling the upper chamber to the lower chamber.
A mobile system for preconditioning a semiconductor processing chamber having an upper chamber and a lower chamber includes a mobile cart, a hot gas recirculating system coupled to the mobile cart and adapted to couple to the upper chamber, a vacuum source coupled to the cart and adapted to couple to the upper chamber, a leak rate testing source coupled to the cart and adapted to couple to the upper chamber, and a particle count testing source coupled to the cart and adapted to couple to the upper chamber.
Embodiments of the invention provide numerous technical advantages. For example, a technical advantage of one embodiment of the present invention is that there is a reduction in time from when a semiconductor wafer is processed to preconditioning a processing chamber for the next processing cycle. Another technical advantage of one embodiment of the present invention is the reduction of processing variables such as processing chamber vacuum leak rates and processing chamber particle counts. Utilizing one embodiment of the present invention results in a processing chamber being ready for use as soon as one processing cycle is finished using another preconditioned processing chamber. The preconditioned processing chamber is held under vacuum and the leak rates and particle counts are already known; therefore, the processing chamber just needs to be set up and used. Other technical advantages are readily apparent to one skilled in the art from the following figures, descriptions, and claims.
REFERENCES:
patent: 5690795 (1997-11-01), Rosenstein et al.
patent: 5834827 (1998-11-01), Miyasaka et al.
patent: 6322716 (2001-11-01), Qiao et al.
patent: 2002/0073925 (2002-06-01), Noble et al.
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