Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2005-01-04
2005-01-04
Cuneo, Kamand (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S757020, C324S765010
Reexamination Certificate
active
06838896
ABSTRACT:
A single gas tight system may perform multi-functions including reducing the thickness of oxides on contact pads and probing, testing, burn-in, repairing, programming and binning of integrated circuits. A holding fixture holds a wafer having integrated circuits and aligns the wafer to a full-substrate probing device. A temperature control device is used to heat the wafer during an oxide reduction process or during burn-in of the wafer. During the oxide reduction process, hydrogen is introduced into the chamber, and the wafer is heated so that the oxides on the contact pads can combine with hydrogen to form water vapor, thus reducing the thickness of the oxides. A computer analyzes the test and/or burn-in data and provides control signals for repairing or programming the integrated circuits.
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Cuneo Kamand
Elm Technology Corporation
Kobert Russell M
Morrison & Foerster / LLP
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