Method and system for planarizing integrated circuit material

Details Method and system for planarizing integrated circuit material Method and system for planarizing integrated circuit material

2006-12-05

2006-12-05

Rose, Robert A. (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S041000

Reexamination Certificate

active

07144301

ABSTRACT:
For planarizing an IC (integrate circuit) material, a first slurry is dispensed for a first planarization of the IC material using the first slurry, and a second slurry is dispensed for a second planarization of the IC material using the second slurry. The first and second slurries are different. For example, the first slurry is silica based for faster planarization during the first planarization. Thereafter, the second planarization is performed with the second slurry that is ceria based with higher planarity for attaining sufficient planarization of the IC material.

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