Method and system for pad conditioning in an ECMP process

Details Method and system for pad conditioning in an ECMP process Method and system for pad conditioning in an ECMP process

2007-01-31

2010-10-05

Neckel, Alexa (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic erosion of a workpiece for shape or surface...

C205S644000

Reexamination Certificate

active

07807036

ABSTRACT:
A method and system for pad conditioning in an electrochemical mechanical planarization (eCMP) tool is disclosed. A polishing pad having a pad electrode is placed onto a platen of the eCMP tool. A conditioning disk, having a second electrode is placed on the polishing pad, such that the pad electrode and conditioning disk form an electrode pair. An electric potential is established between the conditioning disk and the pad electrode. This causes debris from the polishing pad to become ionized, and attracted to the conditioning disk. The conditioning disk is then removed from the eCMP tool, allowing the eCMP tool to resume operation on normal semiconductor wafers.

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