Method and system for optically enhanced metal planarization

Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – With irradiation or illumination

Reexamination Certificate

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C205S667000

Reexamination Certificate

active

10637731

ABSTRACT:
The methods and systems described provide for radiation assisted material deposition, removal, and planarization at a surface, edge, and/or bevel of a workpiece such as a semiconductor wafer. Exemplary processes performed on a workpiece surface having topographical features include radiation assisted electrochemical material deposition, which produces an adsorbate layer outside of the features to suppress deposition outside of the features and to encourage, through charge conservation, deposition into the features to achieve, for example, a planar surface profile. A further exemplary process is radiation assisted electrochemical removal of material, which produces an adsorbate layer in the features to suppress removal of material from the features and to encourage, through charge conservation, removal of material outside of the features so that, for example, a planar surface profile is achieved.

REFERENCES:
patent: 4024029 (1977-05-01), Rain et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 6074546 (2000-06-01), Sun et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6352623 (2002-03-01), Volodarsky et al.
patent: 6534116 (2003-03-01), Basol
patent: 6833063 (2004-12-01), Basol
patent: 6936154 (2005-08-01), Basol et al.

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