Method and system for optical packaging

Details Method and system for optical packaging Method and system for optical packaging

2005-09-06

2005-09-06

Ullah, Akm Enayet (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S073000

Reexamination Certificate

active

06939059

ABSTRACT:
Method and system for an optical package are disclosed. In one embodiment of the present invention, an optical package comprises: a lead frame; a substrate mounted inside the lead frame; one or more leads attached to the substrate; an optical device or component such as a LOA chip mounted on top of the substrate; a window cap hermetically sealing the optical device or component; one or more lens attached to either side of the window cap; two fibers attached on either side of the window cap; two holes or vias that may serve as inputs into the window cap or outputs from the window cap; an electrical out extending from the window cap; and an electrically isolated enclosure enveloping all contents inside the lead frame.

REFERENCES:
patent: 5485317 (1996-01-01), Perissinotto et al.
patent: 5703992 (1997-12-01), Bergmann
patent: 6367624 (2002-04-01), Szczepanski et al.
patent: 6416238 (2002-07-01), Gilliland et al.
patent: 6457876 (2002-10-01), Sawai
patent: 6621616 (2003-09-01), Bauer et al.

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