Method and system for multi-layer printed circuit board pre-dril

Details Method and system for multi-layer printed circuit board pre-dril Method and system for multi-layer printed circuit board pre-dril

1986-10-09

1988-12-13

Abrams, Neil

Cutting by use of rotating axially moving tool

Processes

Bit detachable

83 71, 408 3, 408 16, B23C 300

Patent

active

047906944

ABSTRACT:
A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. A template having precisely located target holes and fixture reference marks provides initial coordinate reference information for multi-layer printed circuit boards to be inspected by x radiation. Each board is processed by insertion into a holding fixture, examination of four quadrant target areas using x-ray sources and detectors, digitization of the target area images in each quadrant, and computaton of the optimum board position in a follow-on drilling apparatus. After optimization, three reference holes are punched along one edge of the board to provide accurate fiducial positioning marks when the board is placed in the drilling apparatus.

REFERENCES:
patent: 3447924 (1969-06-01), Trzyna
patent: 3573455 (1968-09-01), Suierveld
patent: 3663114 (1972-05-01), Welsh et al.
patent: 4176281 (1979-11-01), Tischer et al.
patent: 4280775 (1981-07-01), Wood
patent: 4361634 (1982-11-01), Miller
patent: 4708545 (1987-11-01), Fujii et al.

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